TMM4 2-Layer 60mil Silver-Gold PCB for Microwave Circuit Applications
1.Introduction of TMM4
Rogers TMM 4 thermoset microwave material is a ceramic, hydrocarbon, thermoset polymer composite designed for high plated-thru-hole reliability strip-line and micro-strip applications.
TMM 4 thermoset microwave materials have strong mechanical and chemical properties combine many of the benefits of both ceramic and traditional PTFE laminates without requiring the specialized production techniques common to those materials. TMM4 laminates are based on thermoset resins, making them reliable for wire-bonding without pad lifting or substrate deformation.
2.Key Features
Stable Dielectric Constant: 4.50 ±0.045
Low Loss Performance: Dissipation factor of 0.0020 at 10GHz
Excellent Thermal Stability: Thermal coefficient of Dk of 15ppm/°K
Dimensional Reliability: Coefficient of thermal expansion matched to copper
Consistent CTE: Coefficient of Thermal Expansion x 16 ppm/°K, y 16 ppm/°K, z 21 ppm/°K
High Temperature Resistance: Decomposition Temperature (Td) of 425°C TGA
Effective Thermal Management: Thermal Conductivity of 0.7 W/mk
Environmental Tolerance: Moisture absorption of 0.07%-0.18%
Wide Availability: Thickness range from 0.0015 to 0.500 inches (±0.0015")
3.Benefits
Mechanical Stability: Mechanical properties resist creep and cold flow
Chemical Resistance: Resistant to process chemicals, reducing damage during fabrication
Wire Bonding Reliability: Based on thermoset resin, allowing for reliable wire-bonding
Structural Integrity: High reliability of plated through holes
Manufacturing Flexibility: All common PWB processes can be used with TMM 4 materials
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | TMM4 |
| Layer Count | 2 layers |
| Board Dimensions | 47mm × 118mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 5/7 mils |
| Minimum Hole Size | 0.35mm |
| Blind Vias | No |
| Finished Board Thickness | 1.6mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Silver and gold plating (Gold over silver plating) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (12-Layer Rigid Structure)
Copper Layer 1 - 35 μm
Rogers TMM4 Core - 1.524 mm (60mil)
Copper Layer 2 - 35 μm
6.PCB Statistics:
Components: 32
Total Pads: 65
Thru Hole Pads: 39
Top SMT Pads: 26
Bottom SMT Pads: 0
Vias: 78
Nets: 2
7.Typical Applications
RF and microwave circuitry
Power amplifiers and combiners
Filters and couplers
Satellite communication systems
Global Positioning Systems Antennas
Patch Antennas
Dielectric polarizers and lenses
Chip testers
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
